Multifunction tool for outer sheath, bonded semiconductor and insulation
Technical sheet
/ Use
The MF3NP/40 tools enables the user to : > Remove the outer sheath (PE-PVC-PR) with a straight and neat cut. > Remove the bonbed semiconductor with a chamfer and a minimum remaining length of semiconductor of 40 mm > Remove the insulation with a neat and straight cut
Silicon required for the removal of bonded semiconductor