The CAMF4/40-90-BBCF enables the user :
-To remove the bonded semiconductor
-To remove the insulation

The ball bearings in contact with the cable enable an easy rotation of the tool

Bonded semiconductor removal : Very steady (16 ball bearings rolling around the cable), shaping the cable round over the insulation , constant diameter over the insulation, prevent the blade from diging into the insulation, perform a chamfer on transition beetween the insulation and the semiconductor

Insulation removal : Back-iron that enables the user to tune the pitch of the tool thus making the rotation of the tool easy when removing the insulation