4 Functions MV case for peelable and non-peelable semiconductor
Technical sheet
/ Products contained in the kit
MF3/60-C
CWB/18-60-MVS
DSP
/ Use
The CMV-3F-P kit contains the tools needed to remove the outer sheath, cut the non-strippable and strippable semiconductors, and strip the insulation.
An additional slot is provided to supplement the basic tools with PRG3 pliers or a chamfer stylus for the insulation end.