Multifunction tool for outer sheath, bonded semiconductor and insulation
Technical sheet
/ Spare parts
LMF2
/ Use
The MF3NP/60 tools enables the user to : > Remove the outer sheath (PE-PVC-PR) with a straight and neat cut. > Remove the bonbed semiconductor with a chamfer and a minimum remaining length of semiconductor of 40 mm > Remove the insulation with a neat and straight cut
Silicon required for the removal of bonded semiconductor.
Advantages
Adjustment of the tool feed (chip thickness)
/ Technical specifications
Specific tools
:
Cable tools
Cable tools
:
Cable tools
Operating voltage (V)
:
HTA (1 000 V to 50 000 V)
Packaging
:
Carton box
Weight (kg)
:
1,03
Lenght (mm)
:
165
Width (mm)
:
80
Height (mm)
:
100
Max diameter (mm)
:
60
Mini diameter (mm)
:
16
Chamfer angle (°)
:
14,5
Profondeur d'incision sur semi pelable
:
0,4 - 1,4