Tools
Tools > MF3NP/60

MF3NP/60

Multifunction tool for outer sheath, bonded semiconductor and insulation
Technical sheet
Pulse 32 Darkbg
/ Spare parts
LMF2
/ Use
The MF3NP/60 tools enables the user to :
> Remove the outer sheath (PE-PVC-PR) with a straight and neat cut.
> Remove the bonbed semiconductor with a chamfer and a minimum remaining length of semiconductor of 40 mm
> Remove the insulation with a neat and straight cut

Silicon required for the removal of bonded semiconductor.
Advantages
Penta Bulletpoint Adjustment of the tool feed (chip thickness)
/ Technical specifications
Penta Bulletpoint Specific tools : Cable tools
Penta Bulletpoint Cable tools : Cable tools
Penta Bulletpoint Operating voltage (V) : HTA (1 000 V to 50 000 V)
Penta Bulletpoint Packaging : Carton box
Penta Bulletpoint Weight (kg) : 1,03
Penta Bulletpoint Lenght (mm) : 165
Penta Bulletpoint Width (mm) : 80
Penta Bulletpoint Height (mm) : 100
Penta Bulletpoint Max diameter (mm) : 60
Penta Bulletpoint Mini diameter (mm) : 16
Penta Bulletpoint Chamfer angle (°) : 14,5
Penta Bulletpoint Profondeur d'incision sur semi pelable : 0,4 - 1,4
Penta Bulletpoint Cutting depth (max) on insulation : 7