Technical sheet
/ ORACL
Tool to perform controlled longitudinal scoring on peelable semiconductor
See online technical sheet
/ Use
The ORACL enables the user to score longitudinaly the peelable semiconductive layer in order to peel it off by hand.
Adjustable scoring depths (0.4 / 0.6 / 0.9 / 1.1 mm)
Adjustable scoring depths (0.4 / 0.6 / 0.9 / 1.1 mm)
/ Advantages
Robust design
Ajustement rapide de 4 profondeurs de coupe
4 cutting depths
Des stries au dos de l'outil qui facilitent la préhension du semiconducteur après incision
/ Areas of activity
Cable & Connections
Electrical distribution
Industry
Technical sheet
/ Technical specifications
Specific tools
:
Cable tools
Cable tools
:
Cable tools
Areas of activity
:
Cable & Connections, Electrical distribution, Industry
For network cables
:
medium voltage
Packaging
:
Carton box
Weight (g)
:
160
Lenght (mm)
:
135
Width (mm)
:
55
Height (mm)
:
35
Max diameter (mm)
:
100
Mini diameter (mm)
:
10
Remining length of semi conductor (MIN) (mm)
:
10 (gaine) / 4 (écran)
Scoring depth MAX (mm)
:
1.1
Longitudinal cutting depth (mm)
:
0.4 / 0.6 / 0.9 / 1.1
Tools king
:
Specific tools
/ Spare parts
| Reference | Designation | |
|---|---|---|
|
LSO | Blade for cutting the peelable semiconductor of MV cables |
/ Associated products
| Reference | Designation | |
|---|---|---|
|
DSP | Peelable semiconductor lifter |
|
MVS | Stop for tools |