Technical sheet
/ GRI
Scraper for semiconductor residues
See online technical sheet
/ Standards
ENEDIS
/ Use
GRI scraper enables the user to remove external bonded semiconductor residue stayed on the cable insulation.
/ Advantages
Robust design
Safe
Ergonomic
/ Areas of activity
Cable & Connections
Technical sheet
/ Technical specifications
Specific tools
:
Cable tools
Cable tools
:
Cable tools
Areas of activity
:
Cable & Connections
For network cables
:
medium voltage
Packaging
:
Carton box
Weight (g)
:
190
Lenght (mm)
:
250
Width (mm)
:
40
Height (mm)
:
25
Max diameter (mm)
:
240
Mini diameter (mm)
:
15
Tools king
:
Specific tools
/ Spare parts
| Reference | Designation | |
|---|---|---|
|
LGR | Spare balde scrape semiconductor |
/ Associated products
| Reference | Designation | |
|---|---|---|
|
CWB/18-60-FEP | Tool to remove bonded semiconductor with chamfer on the semiconductor cutback |
|
CWB/18-60-MVS | Tool to remove bonded semiconductor with chamfer on the semiconductor cutback and stop for MV cable |
|
BRMRD1E | Insulation remover 14 - 40 mm |
|
CAMF6/100-180 | Multifunction tool for bonded semiconductor and insulation |
|
CAMF5/55-160-BBCF | Multifunction tool for bonded semiconductor and insulation |
|
CAMF4/40-90-BBCF | Multifunction tool for bonded semiconductor and insulation |
|
AMSI SERIE | ALROC Machine Semicon Insulation Ø15 to 165mm |
|
MF1+/60 | Tool for bonded semiconductor |
|
MF1+/ SERIE | Tool for bonded semiconductor |
|
MF3NP/60 | Multifunction tool for outer sheath, bonded semiconductor and insulation |
|
|
MF1+/25 | Tool for bonded semiconductor |
|
Multifunction tool for outer sheath, bonded semiconductor and insulation | |
|
|
CWB/18-60 | Tool to remove bonded semiconductor with chamfer on the semiconductor cutback |
|
CWB/12-44 | Tool to remove bonded semiconductor with chamfer on the semiconductor cutback |