Technical sheet
/ ASC SERIE
Tools for bonded semiconductor and chamfer
See online technical sheet
/ Use
ASC tools allow the removal of the non-peelable semiconductor with the creation of a chamfer and a very correct surface finish.
/ Advantages
Robust design
Lightweight
Easy to get to grips with
Technical sheet
/ Technical specifications
Specific tools
:
Cable tools
Cable tools
:
Cable tools
For network cables
:
medium voltage
Packaging
:
Carton box
Technical sheet
| Product reference | Incision depth on semi-peelable material | Weight | Lenght | Width | Height | Max diameter | Mini diameter |
|---|---|---|---|---|---|---|---|
| ASC 25F | 0,4 à 1 mm | 550 g | 195 mm | 105 mm | 130 mm | 44 mm | 14 mm |
| ASC 40R1 | 0,1 à 1,4 mm | 650 g | - | - | - | 40 mm | 14 mm |
| ASC R1 | 0,1 à 1,4 mm | 620 g | 205 mm | 110 mm | 135 mm | 40 mm | 14 mm |
| ASCR2 | 0,1 à 1,4 mm | 800 g | 220 mm | 120 mm | 135 mm | 50 mm | 20 mm |