Technical sheet
/ CAMF5/55-160-BBCF
Multifunction tool for bonded semiconductor and insulation
See online technical sheet
/ Use
CAMF SERIE tools enable the user to :
- remove the bonded semiconductor
- remove the insulation
Bonded semiconductor removal : very steady (16 ball bearings around the cable), shaping the cable round over the insulation, constant diameter over the insulation, prevent the blade from diging into the insulation
Insulation removal : back-iron that enables the user to tune the pitch od the tool thus making the rotation of the tool easy when removing the insulaton
- remove the bonded semiconductor
- remove the insulation
Bonded semiconductor removal : very steady (16 ball bearings around the cable), shaping the cable round over the insulation, constant diameter over the insulation, prevent the blade from diging into the insulation
Insulation removal : back-iron that enables the user to tune the pitch od the tool thus making the rotation of the tool easy when removing the insulaton
/ Advantages
No silicon needed
Robust design
/ Areas of activity
Cable & Connections
Industry
Production
Technical sheet
/ Technical specifications
Specific tools
:
Cable tools
Cable tools
:
Cable tools
Areas of activity
:
Cable & Connections, Industry, Production
For network cables
:
high voltage
Packaging
:
Case
Weight (kg)
:
9,5
Lenght (mm)
:
700
Width (mm)
:
255
Height (mm)
:
180
Max diameter (mm)
:
160
Mini diameter (mm)
:
55
Cut deepness (mm)
:
35
Remining length of semi conductor (MIN) (mm)
:
80
Scoring depth MAX (mm)
:
3
Tools king
:
Specific tools
/ Spare parts
| Reference | Designation | |
|---|---|---|
|
LFNS | LFNS |
|
LINS | LINS |
/ Associated products
| Reference | Designation | |
|---|---|---|
|
DMSR/80-160 | Stripping tool for HV and EHV cable’s outer sheath and shield |
|
GRI | Scraper for semiconductor residues |