Technical sheet
/ CWB/18-60-MVS-8
Tool to remove bonded semiconductor with chamfer on the semiconductor cutback and stop for MV cable
See online technical sheet
/ Use
The CWB/18-60-MVS-8 enables the user to easily remove the bonded semi-conductor without silicon and with a chamfer on the semicon cutback. The MVS sits on the cable to stop the CWB/18-60-MVS-8 with a large contact surface.
/ Advantages
No silicon needed
Cutting depth with 1/10 mm increments
Smooth finish
Robust design
Easy to get to grips with
/ Areas of activity
Cable & Connections
Electrical distribution
Industry
Substation
Technical sheet
/ Technical specifications
Specific tools
:
Cable tools
Cable tools
:
Cable tools
Areas of activity
:
Cable & Connections, Electrical distribution, Industry, Substation
For network cables
:
medium voltage
Packaging
:
Carton box
Weight (g)
:
900
Lenght (mm)
:
235
Width (mm)
:
125
Height (mm)
:
90
Max diameter (mm)
:
60
Mini diameter (mm)
:
18
Cut deepness (mm)
:
1,8
Chamfer angle (°)
:
8
Tools king
:
Specific tools
/ Spare parts
| Reference | Designation | |
|---|---|---|
|
LCWB-SP2 | Blade for bonded semi-conductor 8° |