Technical sheet
/ CWB/12-44
Tool to remove bonded semiconductor with chamfer on the semiconductor cutback
See online technical sheet
/ Standards
ENEDIS
/ Use
The CWB/12-44 enables the user to remove the bonded semicon with a chamfer on the semiconductor cutback
/ Advantages
No silicon needed
Cutting depth with 1/10 mm increments
No clamp stopper needed
Le temps de ponçage requis est très faible, voire quasiment superflu
/ Areas of activity
Cable & Connections
Electrical distribution
Industry
Substation
Technical sheet
/ Technical specifications
Specific tools
:
Cable tools
Cable tools
:
Cable tools
Areas of activity
:
Cable & Connections, Electrical distribution, Industry, Substation
For network cables
:
medium voltage
Packaging
:
Carton box
Weight (g)
:
525
Lenght (mm)
:
185
Width (mm)
:
103
Height (mm)
:
74
Max diameter (mm)
:
44
Mini diameter (mm)
:
12
Cut deepness (mm)
:
1.8
Chamfer angle (°)
:
13
Limit stop
:
None
Remining length of semi conductor (MIN) (mm)
:
25
Tools king
:
Specific tools
/ Spare parts
| Reference | Designation | |
|---|---|---|
|
LCWB-FEP-V | Blade for bonded semi-conductor 13° + screws |
/ Associated products
| Reference | Designation | |
|---|---|---|
|
PG3HTA/2020 | Pliers for MV cable outer sheath |
|
|
PG3HTA/2828 | Pliers for MV cable outer sheath |
|
MF2/45 | Multifunction tool for outer sheath and insulation |
|
|
PG3HTA/3035 | PG3HTA/3035 |
|
BRMRD1E | Insulation remover 14 - 40 mm |
|
|
PG3HTA/2530 | Pliers for MV cable outer sheath |
|
GRI | Scraper for semiconductor residues |