Technical sheet
/ MF1+/60
Tool for bonded semiconductor
See online technical sheet
/ Standards
ENEDIS
/ Use
The MF1+/60 is a tool that enables the user to shave the bonded semiconductor at the desired length with a chamfer on the semiconductor cutback
Stylus in option score the peelable semiconductor or chamfer the insulation
Silicone required for non peelable semiconductor
Stylus in option score the peelable semiconductor or chamfer the insulation
Silicone required for non peelable semiconductor
/ Advantages
Cutting depth with 1/10 mm increments
Smooth finish
Robust design
Fast deployment
Cable restraint plate for improved cable stability
/ Areas of activity
Cable & Connections
Electrical distribution
Industry
Production
Substation
Electric traction
Technical sheet
/ Technical specifications
Specific tools
:
Cable tools
Cable tools
:
Cable tools
Areas of activity
:
Cable & Connections, Electrical distribution, Industry, Production, Substation, Electric traction
For network cables
:
medium voltage
Packaging
:
Carton box
Weight (kg)
:
1,04
Lenght (mm)
:
305
Width (mm)
:
85
Height (mm)
:
100
Max diameter (mm)
:
60
Mini diameter (mm)
:
18
Cut deepness (mm)
:
1.4
Chamfer angle (°)
:
14.5
Limit stop
:
None
Remining length of semi conductor (MIN) (mm)
:
30
Tools king
:
Specific tools
/ Spare parts
| Reference | Designation | |
|---|---|---|
|
LASCR1 | Blade for bonded semiconductor |
/ Associated products
| Reference | Designation | |
|---|---|---|
|
GRI | Scraper for semiconductor residues |