Technical sheet
/ MF1+/ SERIE
Tool for bonded semiconductor
See online technical sheet
/ Use
The MF1+ is a tool that enables the user to shave the bonded semiconductor at the desired length with a chamfer on the semiconductor cutback
Stylus in option score the peelable semiconductor or chamfer the insulation
Silicone required for non peelable semiconductor
Stylus in option score the peelable semiconductor or chamfer the insulation
Silicone required for non peelable semiconductor
Technical sheet
/ Technical specifications
Specific tools
:
Cable tools
Cable tools
:
Cable tools
For network cables
:
HTA (1 000 V to 50 000 V)
Packaging
:
Carton box
/ Spare parts
| Reference | Designation | |
|---|---|---|
|
LASCR1 | Blade for bonded semiconductor |
/ Associated products
| Reference | Designation | |
|---|---|---|
|
SCH | Insulation chamfering stylus |
|
DSP | Peelable semiconductor lifter |
|
GRI | Scraper for semiconductor residues |
Technical sheet
| Product reference | Remining length of semi conductor (MIN) | Weight | Weight | Lenght | Height | Max diameter | Mini diameter |
|---|---|---|---|---|---|---|---|
| MF1+/25 | 25 mm | 750 g | - | 190 mm | 125 mm | 44 mm | 14 mm |
| MF1+/60 | 30 mm | - | 1,04 kg | 305 mm | 100 mm | 60 mm | 18 mm |