Technical sheet
/ LHS2
Tool for bonded non peelable semiconductor with silicone
See online technical sheet
/ Use
The LHS2 enables the user to remove bonded semiconductor realizing a right stop.
Use of silicone necessary.
Use of silicone necessary.
/ Advantages
Smooth finish
Counter-iron to regulate tool feed and facilitate rotation
Technical sheet
/ Technical specifications
Specific tools
:
Cable tools
Cable tools
:
Cable tools
For network cables
:
HTA
Packaging
:
Carton box
Lenght (mm)
:
425
Width (mm)
:
105
Height (mm)
:
85
Weight (kg)
:
2
Max diameter (mm)
:
60
Mini diameter (mm)
:
38
Cut deepness (mm)
:
5
/ Spare parts
| Reference | Designation | |
|---|---|---|
|
LASC2 | Blade for non-peelable semiconductor |
/ Associated products
| Reference | Designation | |
|---|---|---|
|
LH2 | Monofunction tool for MV cables insulation |