Technical sheet
/ ASC R1
Tools for bonded semiconductor and chamfer
See online technical sheet
/ Use
ASC tools allow the removal of the non-peelable semiconductor with the creation of a chamfer and a very correct surface finish.
/ Advantages
Robust design
Lightweight
Easy to get to grips with
Technical sheet
/ Technical specifications
Specific tools
:
Cable tools
Cable tools
:
Cable tools
For network cables
:
HTA
Packaging
:
Carton box
Width (mm)
:
110
Height (mm)
:
135
Max diameter (mm)
:
40
Mini diameter (mm)
:
14
Incision depth on semi-peelable material
:
0,1 à 1,4 mm
Lenght (mm)
:
205
Weight (g)
:
620
/ Spare parts
| Reference | Designation | |
|---|---|---|
|
LASCR1 | Blade for bonded semiconductor |