The MF1+/60 is a tool that enables the user to shave the bonded semiconductor at the desired length with a chamfer on the semiconductor cutback Stylus in option score the peelable semiconductor or chamfer the insulation
Silicone required for non peelable semiconductor
Advantages
Cutting depth with 1/10 mm increments
Smooth finish
Heavy duty
Fast deployment
Cable restraint plate for improved cable stability
/ Technical specifications
Specific tools
:
Cable tools
Cable tools
:
Cable tools
Areas of activity
:
Cable & Connections, Electrical distribution, Industry, Production, Substation, Electric traction