Tool to perform controlled longitudinal scoring on peelable semiconductor
Product video
EU Certificate
Technical sheet
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/ Areas of activity
Cable & Connections
Electrical distribution
Industry
/ Spare parts
LSO
/ Associated products
DSP
MVS
/ Use
The ORACL enables the user to score longitudinaly the peelable semiconductive layer in order to peel it off by hand.
Adjustable scoring depths (0.4 / 0.6 / 0.9 / 1.1 mm)
Advantages
Heavy duty
Ajustement rapide de 4 profondeurs de coupe
4 cutting depths
Des stries au dos de l'outil qui facilitent la préhension du semiconducteur après incision
/ Technical specifications
Specific tools
:
Cable tools
Cable tools
:
Cable tools
Areas of activity
:
Cable & Connections, Electrical distribution, Industry