Tools
Tools > MF1+/ SERIE
EU Certificate
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MF1+/ SERIE

Tool for bonded semiconductor
EU Certificate
English Technical sheet
/ Spare parts
LASCR1
/ Associated products
SCH
DSP
GRI
/ Use
The MF1+ is a tool that enables the user to shave the bonded semiconductor at the desired length with a chamfer on the semiconductor cutback
Stylus in option score the peelable semiconductor or chamfer the insulation
Silicone required for non peelable semiconductor
/ Technical specifications
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Product reference Weight Weight Lenght Height Max diameter Mini diameter Remining length of semi conductor (MIN) Technical sheet Quantity
MF1+/25 750 g - 190 mm 125 mm 44 mm 14 mm 25 mm
Pulse 32 Darkbg
MF1+/60 - 1,04 kg 305 mm 100 mm 60 mm 18 mm 30 mm
Pulse 32 Darkbg